PCBA Process Control

Create controlled manufacturing plans, material traceability, soldering profiles, operator and equipment records, process verification, cleanliness evidence, inspection, rework and final release documentation aligned with IPC J-STD-001 process-control requirements.

Unsaved record

Product class not selected

Project and Document Control

Organisation

Customer

Project / Contract

Purchase Order

Assembly Name

Assembly Part Number

Drawing / Revision

Quantity

Production Lot / Batch

Serial Number Range

Traveller / Route Card

Manufacturing Plan No.

Plan Revision

Build Record No.

Build Date

Shift / Line

Assembly Description, Intended Use and Critical Characteristics

The application records compliance evidence but does not reproduce IPC’s proprietary acceptance criteria. Inspectors and operators must use authorised copies of the applicable standard, addendum, drawing and customer requirements.

IPC and Customer Requirement Basis

J-STD-001 Revision

Product Class

IPC-A-610 Revision

Addendum / Sector Requirement

Customer Workmanship Specification

Customer Specification Revision

Assembly Drawing / BOM Revision

Approved Process Specification

Lead-free / Leaded Status

RoHS / Regulatory Requirement

Moisture Sensitivity Requirement

ESD Classification / Requirement

Operator Certification Requirement

Inspector Certification Requirement

Rework Standard

Cleaning / Residue Qualification

Special Requirements, Prohibited Materials and Departures

Current controlled standards available

Product class defined by customer

Drawing and BOM revisions verified

Operators appropriately trained

Inspectors appropriately trained

Customer exceptions resolved

Material and Component Traceability

Record bare boards, components, solder alloys, solder paste, flux, wire, adhesives, staking materials, cleaners, coatings and process consumables.

Material / Component	Part / Type	Specification	Manufacturer	Lot / Date Code	Certificate	Expiry	Storage / MSL	Incoming Status

Bare PCB Part / Lot

PCB Surface Finish

PCB Acceptance Reference

PCB Bake Requirement

Solder Alloy

Solder Paste Type / Lot

Flux Classification / Lot

Solder Wire Lot

Paste Storage Temperature

Paste Thaw / Working Life

Component MSL Control

Dry Cabinet / Bake Record

Adhesive / Staking Material

Cleaner / Solvent

Conformal Coating / Lot

Underfill / Encapsulant

Equipment, Environment and Personnel

Assembly Line / Area

Temperature / Humidity

ESD Area / Verification

Ioniser / Ground Check

Stencil Printer ID

Pick-and-place ID

Reflow Oven ID

Wave / Selective Solder ID

Hand Soldering Station ID

Cleaning Equipment ID

AOI / X-ray Equipment

Calibration Status

Lead Operator / Certification

Process Engineer

Inspector / Certification

FOD / Housekeeping Status

Assembly Operation Record

Sequence	Operation	Equipment / Programme	Process Parameters	Lot / Material	Actual Result	Operator	Inspection

Stencil ID / Thickness

Printer Programme / Revision

Squeegee / Pressure / Speed

Solder Paste Inspection Criteria

Placement Programme / Revision

Feeder Setup Verification

Polarity / Orientation Verification

First-off Approval

Reflow Soldering Profile

Profile / Recipe ID

Recipe Revision

Conveyor Speed

Atmosphere / Oxygen Level

Preheat Ramp Rate

Soak Range / Time

Time Above Liquidus

Peak Temperature

Cooling Rate

Profile Board / TC Locations

Profile Date / File

Profile Conformance

Wave, Selective and Hand Soldering Controls

Flux Application / Amount

Preheat Temperature

Solder Pot Temperature

Conveyor / Contact Time

Wave / Nozzle Setup

Solder Pot Analysis

Dross / Contamination Control

Selective Programme / Revision

Hand Iron Tip / Size

Hand Iron Temperature

Maximum Contact / Dwell

Thermal Heat Sink Requirement

Soldering Process Verification

Process / Area	Requirement	Actual Parameter	Board / Sample	Inspection Method	Result	Record / File	Reviewer

Cleaning and Process Residue Control

Cleaning Process

Cleaning Chemistry / Concentration

Cleaning Temperature / Time

Rinse Water Quality

Drying Method / Parameters

Cleanliness Qualification Method

Production Monitoring Method

Test Frequency

ROSE / Ionic Result

Localised Extraction Result

SIR / Performance Test Reference

Visual Residue Result

Conformal Coating, Staking and Encapsulation

Coating Type / Specification

Coating Application Method

Masking / Keep-out Control

Target Thickness

Cure Schedule

Thickness Measurement

Coverage / Inspection Result

Adhesion / Cure Verification

Staking Material / Location

Underfill Process

Encapsulant / Potting Process

Final Cure Record

Inspection and Test Results

Characteristic / Area	Requirement / Reference	Method / Equipment	Sample / Serial	Result	Pass / Fail	Report / Record	Inspector

Component identity and orientation accepted

Solder connections accepted

Through-hole fill / lead condition accepted

SMT alignment and terminations accepted

BGA / hidden joints assessed as required

Hardware and mechanical assembly accepted

Cleaning / residue controls accepted

Coating / staking accepted

Marking and traceability verified

Defect, Rework and Repair Register

Board / Serial	Location	Defect / Condition	Disposition	Rework Instruction	Operator	Reinspection Result	NCR / Record

AOI Programme / Revision

X-ray Programme / Criteria

Electrical / Functional Test

Inspection Summary and Technical Evaluation

Nonconformance and Final Release

NCR / Deviation / Concession No.

Disposition / Containment

Certificate of Conformity No.

Final Status

Packaging / ESD Protection

Moisture Barrier / Desiccant

Final Label / Serial Verification

Document Pack Reference

Nonconformance, Deviation and Release Notes

Approval

Manufactured By

Date

Inspected By

Date

Approved By

Date

Customer / Independent Approval

Date